Company Filing History:
Years Active: 2001-2002
Title: Innovations by Yu-Ting Cheng in Microstructure Technology
Introduction
Yu-Ting Cheng is an accomplished inventor based in Ann Arbor, MI (US). She has made significant contributions to the field of microstructure technology, holding 2 patents that showcase her innovative methods and techniques.
Latest Patents
Her latest patents include a method for making a microstructure assembly. This method involves several steps, such as providing a first substrate and a second substrate, depositing an electrically conductive material on the second substrate, and contacting the second substrate with the first substrate. The process further includes supplying current to the electrically conductive material to locally elevate its temperature, resulting in the formation of a bond between the two substrates. Another patent focuses on the process for making microstructures and the microstructures produced by this method, emphasizing the same innovative steps.
Career Highlights
Yu-Ting Cheng is affiliated with the University of Michigan, where she continues to advance her research and development in microstructure technology. Her work has garnered attention for its potential applications in various industries.
Collaborations
Some of her notable coworkers include Liwei Lin and Khalil Najafi, who contribute to her research endeavors and collaborative projects.
Conclusion
Yu-Ting Cheng's innovative work in microstructure technology exemplifies her dedication to advancing the field. Her patents reflect her expertise and commitment to developing new methods that can have a lasting impact.