Company Filing History:
Years Active: 2006-2010
Title: Innovations of Yu Ping Gu
Introduction
Yu Ping Gu is a notable inventor based in Sunnyvale, CA, with a focus on advanced measurement technologies. He holds a total of 3 patents that contribute significantly to the field of wafer measurement.
Latest Patents
One of his latest patents is titled "Method and apparatus for measuring a thickness of a layer of a wafer." This invention provides a method and apparatus for accurately measuring the thickness of a test object using an eddy current sensor with first and second sensor heads. The sensor heads are strategically positioned to allow the test object to pass through a predetermined gap, enabling measurements at specific sampling locations as the object moves. The apparatus also includes a position sensing mechanism to determine the locations of these sampling points, along with an evaluation circuit that communicates with the sensor to ascertain the thickness of the test object.
Another significant patent by Yu Ping Gu is the "Apparatus and method of dynamically measuring thickness of a layer of a substrate." Similar to his previous invention, this apparatus utilizes an eddy current sensor with two heads positioned to measure the thickness of a test object as it passes through the gap. The inclusion of a position sensing mechanism and an evaluation circuit further enhances the accuracy of the measurements taken.
Career Highlights
Yu Ping Gu is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at this organization has allowed him to develop innovative solutions that address complex measurement challenges in the semiconductor industry.
Collaborations
Throughout his career, Yu has collaborated with notable colleagues, including Lawrence C. Lei and Siqing Lu, who contribute to the innovative environment at Applied Materials, Inc.
Conclusion
Yu Ping Gu's contributions to the field of measurement technology through his patents and work at Applied Materials, Inc. highlight his role as a significant inventor in the industry. His innovative methods for measuring thickness in wafers and substrates continue to advance the capabilities of semiconductor manufacturing.