Yu-Ling Hsieh

Title: Yu-Ling Hsieh: Innovator in Substrate Technology

Introduction

Yu-Ling Hsieh is a notable inventor based in Taipei, Taiwan. She has made significant contributions to the field of substrate technology, particularly in the development of innovative solutions that address common challenges in the industry. Her work is characterized by a focus on enhancing the performance and reliability of substrates used in various applications.

Latest Patents

Yu-Ling Hsieh holds a patent for a substrate that comprises a build-up and a solder resist layer disposed on the build-up. The solder resist layer features an upper surface that faces away from the build-up and includes a plurality of grooves. These grooves are designed to better eliminate or relieve the stress that accumulates on large solder resist areas due to heat and material coefficient of thermal expansion mismatch. This innovation helps to prevent and diminish warpage of the substrate or package, showcasing her commitment to improving product durability and performance. She has 1 patent to her name.

Career Highlights

Yu-Ling Hsieh is currently employed at Advanced Micro Devices (Shanghai) Co., Ltd., where she continues to push the boundaries of substrate technology. Her role involves collaborating with a team of experts to develop cutting-edge solutions that meet the evolving needs of the industry.

Collaborations

One of her notable coworkers is I-Tseng Lee, who contributes to the innovative environment at Advanced Micro Devices. Their collaboration exemplifies the synergy that can be achieved when talented individuals work together towards common goals.

Conclusion

Yu-Ling Hsieh's contributions to substrate technology reflect her dedication to innovation and excellence. Her patent demonstrates her ability to address complex challenges in the field, making her a valuable asset to the industry.