Company Filing History:
Years Active: 2020
Title: The Innovative Contributions of Yu Lin
Introduction
Yu Lin is a prominent inventor based in Shenzen, CN. He has made significant strides in the field of integrated circuit technology. His work focuses on enhancing mobile processor capabilities through innovative designs.
Latest Patents
Yu Lin holds a patent for a "Heterogenous 3D chip stack for a mobile processor." This patent describes an integrated circuit package and a system that includes the package, as well as a process for assembling it. The integrated circuit package features a first die manufactured on a first wafer utilizing a first node size, and a second die manufactured on a second wafer utilizing a second node size. Additionally, a substrate is coupled to the second die at multiple bump sites on its bottom surface. The first die can be mounted on the top surface of the second die using a hybrid wafer bonding technique, micro bumps, or electrode-less plating.
Career Highlights
Yu Lin is currently employed at Future Wei Technologies, Inc. His role at the company allows him to explore and develop cutting-edge technologies in the semiconductor industry. His innovative approach has contributed to advancements in mobile processing capabilities.
Collaborations
Yu Lin has collaborated with notable colleagues such as Shiqun Gu and Jinghua Zhu. Their combined expertise fosters a creative environment that drives innovation in their projects.
Conclusion
Yu Lin's contributions to the field of integrated circuits and mobile processors exemplify the impact of innovative thinking in technology. His patent and work at Future Wei Technologies, Inc. highlight his commitment to advancing the industry.