Company Filing History:
Years Active: 2024-2025
Title: Innovations of Yu-Jing Fang
Introduction
Yu-Jing Fang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics, particularly in diode packaging technology. With a total of 2 patents to his name, Fang continues to push the boundaries of innovation in his industry.
Latest Patents
Fang's latest patents include a diode package structure and its manufacturing method. This innovative diode package structure consists of a substrate, at least one diode chip, and an opaque encapsulating layer. The substrate features an electrically conductive layer, and the diode chip is mounted on the substrate, ensuring electrical connectivity. The opaque encapsulating layer is designed with a cap portion and a sidewall portion, which together form a concave structure. Notably, the first contact vertex of the cap portion and the sidewall of the diode chip is higher than the second contact vertex of the cap portion and the sidewall portion, enhancing the overall functionality of the package.
Career Highlights
Yu-Jing Fang is currently employed at Lextar Electronics Corporation, where he applies his expertise in electronics and innovation. His work has been instrumental in advancing the company's product offerings and technological capabilities.
Collaborations
Fang collaborates with talented coworkers, including Hsiang-Chun Hsu and Cheng-Ping Chang, who contribute to the innovative environment at Lextar Electronics Corporation.
Conclusion
Yu-Jing Fang's contributions to diode packaging technology exemplify his commitment to innovation in the electronics field. His patents reflect a deep understanding of engineering principles and a drive to improve electronic components.