Location History:
- Ayer Tawar, MY (2006)
- Perak, MY (2009 - 2010)
Company Filing History:
Years Active: 2006-2010
Title: Young Chee Yu: Innovator in Hardware Packaging Solutions
Introduction
Young Chee Yu is a notable inventor based in Perak, Malaysia. He has made significant contributions to the field of hardware packaging, holding three patents that enhance the efficiency of assembly line operations. His innovative approaches have streamlined processes and improved productivity in manufacturing environments.
Latest Patents
Young Chee Yu's latest patents focus on the packaging and presentation of small hardware items. One of his patents describes a packaging arrangement that allows for the smooth and convenient provision of small hardware items to assembly line operators. The items are fastened onto a flexible band, organized in the order they are to be installed on an article being assembled. Each segment of the band is defined by index marks, containing the hardware items required for the assembly of one article. This design allows for easy removal of items using a tool, enhancing the productivity and reliability of manually assembled articles such as disk drives.
Another patent by Yu elaborates on a similar concept, emphasizing the packaging substrate and presentation of small hardware. The arrangement ensures that items are readily accessible and organized, further improving the efficiency of assembly line operations.
Career Highlights
Throughout his career, Young Chee Yu has worked with various companies, including Esgw Holdings Limited and Esgw Holding Limited. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions for hardware items.
Collaborations
Young Chee Yu has collaborated with professionals in his field, including his coworker Ming-Goei Sheu. These collaborations have fostered an environment of innovation and creativity, leading to the development of effective solutions in hardware packaging.
Conclusion
Young Chee Yu's contributions to the field of hardware packaging have made a significant impact on assembly line efficiency. His innovative patents and collaborative efforts continue to influence the industry positively.