Youhei Yoshimatsu

Title: Youhei Yoshimatsu: Innovator in Copper Clad Laminate Technology

Introduction

Youhei Yoshimatsu is a notable inventor based in Yamaguchi, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper clad laminates. His innovative work has led to advancements that are crucial for modern electronic applications.

Latest Patents

Yoshimatsu holds a patent for a copper clad laminate and the method for producing the same. This invention features a low dielectric resin film with a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz. The laminate includes an electroless copper plating layer that is laminated on at least one surface of the resin film. The electroless copper plating layer contains a Ni content ranging from 0.01 to 1.2 wt %, and it achieves a volume resistivity of 6.0 μΩ·cm or lower. This technology is particularly beneficial for flexible circuit boards, as it minimizes transmission loss while maintaining excellent volume resistivity.

Career Highlights

Yoshimatsu is currently employed at Toyo Kohan Co., Ltd., where he continues to innovate in the field of electronic materials. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Throughout his career, Yoshimatsu has collaborated with notable colleagues, including Nobuaki Mukai and Takahiro Yoshida. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Youhei Yoshimatsu's contributions to the field of copper clad laminates exemplify the importance of innovation in technology. His patented work not only advances material science but also supports the growing demands of the electronics industry.