Chiyoda-ku, Japan

Yoshiyasu Ogata


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Yoshiyasu Ogata

Introduction

Yoshiyasu Ogata is a notable inventor based in Chiyoda-ku, Japan. He has made significant contributions to the field of thermoplastic resin technology. His innovative approach has led to the development of a unique connection method that enhances the functionality of thermoplastic resin long bodies.

Latest Patents

Ogata holds a patent for a connection method of thermoplastic resin long bodies. This method involves interconnecting the end portions of a thermoplastic resin long body, which contains conductive unstretchable members embedded within it. The process utilizes induction heating to melt the thermoplastic resin, allowing for the exposure of the unstretchable members. This innovative technique facilitates a secure butt connection between the exposed members at both ends.

Career Highlights

Yoshiyasu Ogata is associated with Mitsubishi Electric Corporation, where he has been able to apply his expertise in thermoplastic resin technology. His work has contributed to advancements in the manufacturing processes and applications of thermoplastic materials.

Collaborations

Ogata has collaborated with notable colleagues, including Shinji Murata and Jinichi Furukawa. Their combined efforts have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Yoshiyasu Ogata's contributions to the field of thermoplastic resin technology exemplify the spirit of innovation. His patented connection method showcases his ability to solve complex engineering challenges. Through his work at Mitsubishi Electric Corporation, he continues to influence the industry positively.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…