Company Filing History:
Years Active: 1995
Title: The Innovations of Yoshito Hazaki
Introduction
Yoshito Hazaki is a notable inventor based in Okayama, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique resin-sealed semiconductor device.
Latest Patents
Yoshito Hazaki holds a patent for a resin-sealed semiconductor device containing porous fluorocarbon resin. This device includes a chip mounting die pad and a porous fluorocarbon material located just beneath the die pad. The design ensures that any water vapor generated by the heat of soldering is held within the porous fluorocarbon, preventing damage to the sealant under internal pressure. He has 1 patent to his name.
Career Highlights
Yoshito Hazaki is currently employed at Japan Gore-tex Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in enhancing the reliability and performance of semiconductor devices.
Collaborations
Yoshito has collaborated with notable colleagues such as Minoru Hatakeyama and Sunao Fukutake. Their combined expertise has contributed to advancements in their respective fields.
Conclusion
Yoshito Hazaki's contributions to semiconductor technology exemplify the spirit of innovation. His patented designs and collaborative efforts continue to influence the industry positively.