Yoshimura Eiji

Title: Innovations by Yoshimura Eiji in Wiring Board Manufacturing

Introduction

Yoshimura Eiji is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of wiring board manufacturing. His innovative methods have the potential to enhance the efficiency and effectiveness of wiring board production.

Latest Patents

Yoshimura Eiji holds a patent for a "Method for manufacturing wiring board or wiring board material." This patent provides a method that allows columnar metal members to be inserted into the wiring board at once using a simple operation. It enables alignment without requiring strict accuracy and can handle columnar metal members of different shapes. The method imparts sufficiently high adhesive strength to the columnar metal members. The process includes laminating a laminate material that consists of a support sheet with columnar metal members, a wiring board or wiring board material with openings, and a prepreg containing a thermosetting resin. The laminate material is then integrated by heating and pressing, resulting in a laminate that includes a thermosetting resin filled between the inner surface of each opening and the columnar metal members. Finally, the support sheet is peeled from the laminate.

Career Highlights

Yoshimura Eiji is associated with Daiwa Co., Ltd., where he continues to develop and refine his innovative methods. His work has garnered attention for its practical applications in the electronics industry.

Conclusion

Yoshimura Eiji's contributions to wiring board manufacturing demonstrate his commitment to innovation and efficiency. His patented methods are poised to make a significant impact in the field.