Yoshiko Kohno

Title: The Innovations of Yoshiko Kohno

Introduction

Yoshiko Kohno is a prominent inventor based in Okayama, Japan. She has made significant contributions to the field of materials science, particularly in the development of advanced bonding materials and methods. With a total of 2 patents to her name, her work has garnered attention for its innovative approaches and practical applications.

Latest Patents

Kohno's latest patents include a bonding material and bonding method that utilizes a unique silver paste. This bonding material consists of fine silver particles with an average primary particle diameter ranging from 1 to 50 nanometers, each coated with an organic compound such as hexanoic acid. Additionally, the silver paste contains larger silver particles, a solvent, and various dispersants, ensuring optimal performance in bonding applications. Another notable patent involves a metal nanoparticle dispersion that can be bonded at lower temperatures, enhancing the mechanical and electrical properties of the bonded materials. This dispersion includes metal nanoparticles coated with specific amines and a dispersion medium that facilitates effective bonding.

Career Highlights

Kohno is currently employed at Dowa Electronics Materials Co., Ltd., where she continues to innovate and develop new materials. Her work has been instrumental in advancing the capabilities of bonding technologies, making her a valuable asset to her company and the industry at large.

Collaborations

Throughout her career, Kohno has collaborated with notable colleagues such as Keiichi Endoh and Hiromasa Miyoshi. These partnerships have allowed her to expand her research and contribute to various projects within her field.

Conclusion

Yoshiko Kohno's contributions to materials science and her innovative patents highlight her role as a leading inventor in her field. Her work continues to influence advancements in bonding technologies, showcasing the importance of innovation in driving progress.