Yoshikiyo Ogasawara

Title: Innovations of Yoshikiyo Ogasawara

Introduction

Yoshikiyo Ogasawara is a notable inventor based in Himeji, Japan. He has made significant contributions to the field of electronic component packaging, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative packaging solutions.

Latest Patents

One of his latest patents is for an electronic component package and method of manufacturing the same. This invention includes a case with a cavity that houses an electronic component, along with a lid member that is fusion-welded to the case. This design ensures a hermetic seal for the cavity portion. The case features a first metal layer that is exposed on the open side of the cavity, while the lid member has a core portion and a second metal layer facing the case. The fusion-welding layer consists of a soldering material layer, with intermetallic compound layers formed on either side due to diffusion. The ratio of these intermetallic layers is crucial, ranging from about 25% to about 98% of the area of the fusion-welding layer. This innovative package maintains superior airtightness, even in high-temperature environments that exceed the melting point of the soldering material.

Career Highlights

Yoshikiyo Ogasawara has worked with prominent companies in the industry, including Daishinku Corporation and Neomax Co., Ltd. His experience in these organizations has contributed to his expertise in electronic component packaging.

Collaborations

Throughout his career, Ogasawara has collaborated with talented individuals such as Minoru Iizuka and Kazuhiro Shiomi. These partnerships have likely enriched his work and led to further advancements in his field.

Conclusion

Yoshikiyo Ogasawara is a distinguished inventor whose innovations in electronic component packaging have made a significant impact on the industry. His patents reflect a commitment to improving the reliability and performance of electronic devices.