Itami, Japan

Yoshikazu Nakai


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Hyogo, JA (1977)
  • Itami, JP (1991)

Company Filing History:


Years Active: 1977-1991

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2 patents (USPTO):Explore Patents

Title: Innovations of Yoshikazu Nakai

Introduction

Yoshikazu Nakai is a notable inventor based in Itami, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His work focuses on developing methods and compositions that enhance adhesion properties in various applications.

Latest Patents

One of his latest patents is a method of adhesion and composition therefor. This innovative method involves applying a two-step reactive type tacky adhesive agent that includes a non-photopolymerizable epoxy resin or isocyanate compound, a curing agent, and a compound with at least one photopolymerizable vinyl group. The process entails irradiating the applied surface with light to develop tackiness, allowing for effective bonding without the need for clamping. This method is particularly advantageous for materials with curved surfaces that are challenging to bond. Another significant patent is for an unsaturated polyester resin composition. This composition consists of finely powdered coating materials that provide hard, tough, and solvent-resistant coating layers through powder coating methods.

Career Highlights

Yoshikazu Nakai is currently employed at Takeda Chemical Industries, Inc., where he continues to innovate in the field of adhesive technologies. His work has contributed to advancements in materials science and engineering.

Collaborations

He has collaborated with notable coworkers such as Tsutomu Kubota and Akira Ogino, further enhancing the impact of his inventions through teamwork and shared expertise.

Conclusion

Yoshikazu Nakai's contributions to adhesive technology through his patents demonstrate his commitment to innovation and excellence in his field. His work continues to influence the industry and improve bonding methods for various applications.

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