Chiba, Japan

Yoshihisa Fujimoto


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 23(Granted Patents)


Location History:

  • Chiba, JP (1991)
  • Noda, JP (1995)

Company Filing History:


Years Active: 1991-1995

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2 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Yoshihisa Fujimoto**

Introduction

Yoshihisa Fujimoto is a distinguished inventor based in Chiba, Japan, known for his contributions to the field of encapsulation methods for electronic components. With two patents to his name, he has made significant strides in enhancing the durability and functionality of electrical parts through innovative material solutions.

Latest Patents

Fujimoto's latest patent, titled "Method of encapsulating an article," outlines a novel approach to encapsulating electrical components using a specialized epoxy resin-based powder coating composition. This composition includes a carefully formulated mixture of resins and fillers, allowing for high moisture resistance, storage stability, and excellent free-flowing properties when coated on electronic parts at temperatures between 90°C to 100°C. The formulation emphasizes the use of a mixed epoxy resin that combines bisphenol A epoxy resin and cresol novolak epoxy resin, ensuring robust performance in various applications.

Career Highlights

Fujimoto is currently associated with Somar Corporation, where his innovative work continues to shape the company's product offerings. His contributions to improving encapsulation methods reflect both his technical knowledge and dedication to advancing the field of electrical engineering.

Collaborations

Throughout his career, Fujimoto has worked alongside talented colleagues such as Yoshihiro Motoki and Kazufumi Ueji. Their collaborative efforts have fostered an environment of innovation that has driven advancements in encapsulation techniques within the industry.

Conclusion

Yoshihisa Fujimoto stands out as a notable inventor whose work has significantly impacted the encapsulation of electronic components. With his patents paving the way for new solutions in moisture resistance and material performance, his contributions are set to influence the future of electronic manufacturing.

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