Yoshiaki Imaji

Title: Yoshiaki Imaji: Innovator in Power Module Technology

Introduction

Yoshiaki Imaji is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of power semiconductor technology. His innovative approach has led to the development of a unique power module that enhances efficiency and performance.

Latest Patents

Yoshiaki Imaji holds a patent for a "Power module using IMS as heat spreader." This invention features a heat spreader, circuit boards for power semiconductor elements, and a circuit board for a control circuit, all fixed on a metal plate. The heat spreader is constructed from an IMS, which includes a metal base made of copper or a copper-clad plate, along with a high heat radiating insulating layer made from a resin-based material. The design ensures that the metal plate and the heat spreader are adhered by the high heat radiating insulation layer while remaining electrically insulated from each other. A power semiconductor element is soldered onto the heat spreader, and a wiring pattern is formed on a power circuit board to guide each terminal of the power semiconductor element to the outside. Additionally, a control circuit for managing the power semiconductor element is established on the circuit board for the control circuit.

Career Highlights

Yoshiaki Imaji is currently associated with Kabushiki Kaisha Toshiba, a leading company in technology and electronics. His work at Toshiba has allowed him to focus on advancing power module technology, contributing to the company's reputation for innovation.

Collaborations

Throughout his career, Yoshiaki has collaborated with talented individuals such as Satoshi Nakao and Hiroshi Sawano. These collaborations have fostered an environment of creativity and innovation, leading to advancements in their respective fields.

Conclusion

Yoshiaki Imaji's contributions to power module technology exemplify the spirit of innovation. His patent and work at Toshiba highlight his commitment to enhancing the efficiency of power semiconductor applications. His collaborations further enrich the technological landscape, making him a significant figure in the industry.