Beijing, China

Yonggang Liu


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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4 patents (USPTO):Explore Patents

Title: Yonggang Liu: Innovator in Communication and Engineering

Introduction

Yonggang Liu is a prominent inventor based in Beijing, China. He has made significant contributions to the fields of communication and engineering, holding a total of 4 patents. His work focuses on innovative solutions that enhance connectivity and structural integrity in various applications.

Latest Patents

One of Yonggang Liu's latest patents is titled "Device, method, apparatus and computer readable medium for inter-master node handover." This invention addresses the complexities of handover processes between devices, ensuring seamless connectivity. In this patent, the first device transmits an indication to the third device regarding a change in the radio bearer for the second device, which is in dual connectivity with both the third and fourth devices. Another notable patent is related to a "Connection structure between pipe body and steel joint of aluminum alloy drill pipe." This invention details a connection structure that enhances the durability and performance of aluminum alloy drill pipes, featuring a unique design of threaded sections for secure fittings.

Career Highlights

Yonggang Liu has worked with esteemed organizations such as the China National Petroleum Corporation and the Cnpc Tubular Goods Research Institute. His experience in these companies has allowed him to apply his innovative ideas to real-world challenges, contributing to advancements in technology and engineering.

Collaborations

Throughout his career, Yonggang Liu has collaborated with talented individuals, including Fangpo Li and Xiaojun Li. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Yonggang Liu's contributions to innovation in communication and engineering are noteworthy. His patents reflect a commitment to improving technology and enhancing connectivity in various applications. His work continues to inspire future advancements in these fields.

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