Location History:
- Jeollabuk-do, KR (2016)
- Hwaseong-si, KR (2018 - 2019)
Company Filing History:
Years Active: 2016-2019
Title: Yong-won Choi: Innovator in Semiconductor Packaging
Introduction
Yong-won Choi is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work is instrumental in advancing technology in this critical area.
Latest Patents
Yong-won Choi's latest patents focus on innovative semiconductor packages. One of his notable inventions includes a semiconductor package that features a first semiconductor chip with a first through-silicon via (TSV) and a second semiconductor chip stacked on top, which includes a second TSV. A non-conductive film is formed between the two chips, consisting of two layers with different viscosities. This design enhances the performance and reliability of semiconductor devices.
Career Highlights
Choi is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role involves developing advanced semiconductor solutions that meet the growing demands of the industry. His expertise and innovative approach have positioned him as a key player in his field.
Collaborations
Yong-won Choi has collaborated with notable colleagues, including Won-keun Kim and Myung-Sung Kang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Yong-won Choi's contributions to semiconductor packaging exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications, making him a valuable asset to the industry.