Company Filing History:
Years Active: 2000-2025
Title: Innovations by Yong-Ching Chen
Introduction
Yong-Ching Chen is a notable inventor based in Columbus, IN (US). He has made significant contributions to the field of materials science, particularly in the development of advanced steel alloys. With a total of 2 patents, his work showcases innovative approaches to enhancing the properties of ferrous materials.
Latest Patents
One of Yong-Ching Chen's latest patents is focused on a steel alloy and method of manufacture that exhibits an enhanced combination of high-temperature strength, oxidation resistance, and thermal conductivity. This steel alloy features unique properties, including elevated temperature strength and wear resistance. The disclosed embodiments comprise specific amounts of various elements, including C, Si, Mn, Cr, Mo or W, Ti, and V, with the balance being Fe and usual impurities. Another significant patent involves the formation of a graphite-free surface in a ferrous material, which produces an intermetallic bond between ferrous and non-ferrous metals. This innovative method effectively eliminates graphite from the bond layer through various techniques, including electrochemical cleaning and laser surface treatment.
Career Highlights
Yong-Ching Chen has worked with prominent companies such as Cummins Engine Company, Inc. and Cummins Inc. His experience in these organizations has allowed him to apply his innovative ideas in practical settings, contributing to advancements in engineering and materials.
Collaborations
Throughout his career, Yong-Ching Chen has collaborated with notable colleagues, including John A Worden and Gordon L Starr. These collaborations have likely fostered an environment of innovation and shared expertise in their respective fields.
Conclusion
Yong-Ching Chen's contributions to the field of materials science through his patents and career experiences highlight his role as a significant inventor. His work continues to influence advancements in steel alloys and intermetallic bonding techniques.