Yingqiang Yan

Title: Yingqiang Yan: Innovator in Radio Frequency Module Packaging

Introduction

Yingqiang Yan is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of radio frequency technology. His innovative work focuses on enhancing the packaging structures of filter radio frequency modules.

Latest Patents

Yingqiang Yan holds a patent for a "Filter radio frequency module packaging structure and method for manufacturing same." This invention discloses a packaging structure that includes a first filter chip comprising a chip main body and a wall structure. The wall structure, along with a functional surface and a substrate, defines a closed cavity. An encapsulation material wraps the first filter chip, providing improved functionality and protection.

Career Highlights

Yingqiang Yan is affiliated with the Institute of Semiconductors at the Guangdong Academy of Sciences. His work at this prestigious institution has allowed him to focus on advanced research in semiconductor technologies and radio frequency applications.

Collaborations

Yingqiang Yan collaborates with esteemed colleagues, including Chuan Hu and Xun Xiang. Their combined expertise contributes to the advancement of innovative solutions in the semiconductor field.

Conclusion

Yingqiang Yan's contributions to radio frequency module packaging represent a significant advancement in semiconductor technology. His innovative patent showcases his commitment to enhancing the functionality and efficiency of electronic components.