Nanjing, China

Yingbo Peng


 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):

Title: Yingbo Peng: Innovator in TiAl Intermetallic Compounds

Introduction: Yingbo Peng, an accomplished inventor located in Nanjing, China, has made significant contributions to the field of materials science. With a focus on intermetallic compounds, he holds one patent that showcases his expertise and innovative approach.

Latest Patents: Yingbo Peng's patent is titled "TiAl intermetallic compound single crystal material and preparation method therefor." This invention presents a novel TiAl intermetallic compound single crystal material alongside its preparation method. The composition of the alloy comprises TiAlNb(C, Si), characterized by specific parameters: 43 ≤ b ≤ 49, 2 ≤ c ≤ 10, a + b + c = 100, and 0 ≤ d ≤ 1 (at. %). This innovation is poised to advance the applications of intermetallic compounds in various technological fields.

Career Highlights: Yingbo is affiliated with the Nanjing University of Science and Technology, where he continues to contribute his knowledge and experience to research and development. His work not only enhances the understanding of material properties but also opens up new possibilities for industrial applications.

Collaborations: Throughout his career, Yingbo Peng has collaborated with notable colleagues, including Guang Chen and Gong Zheng. Collaborating with such professionals fosters an enriching environment that boosts creative problem-solving and expands research capabilities.

Conclusion: Yingbo Peng stands out as an innovative inventor whose work with TiAl intermetallic compounds is making waves in the material science community. His patent reflects a commitment to pushing the boundaries of technology and providing solutions that could have widespread applications in various industries. As he continues his work at Nanjing University of Science and Technology, the potential for further groundbreaking innovations remains high.

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