This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Silicon Integrated Systems Corporation. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: Innovations of Yin-Chieh Hsueh in Flip Chip Package Structures.
Introduction
Yin-Chieh Hsueh is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs in flip chip package structures. His work has implications for the efficiency and reliability of electronic devices.
Latest Patents
Yin-Chieh Hsueh holds a patent for a flip chip package structure. This structure includes a substrate, an integrated circuit (IC) chip that is electrically connected to the substrate through multiple conductive bumps, and an encapsulant situated between the substrate and the IC chip. Additionally, the design features an electrically protective device that enhances the durability of the package. The substrate is equipped with interior wiring and a series of first contacts arranged at a predetermined pitch. The protective device has a protruding part that covers the IC chip and an extending part that spans the surface of the substrate, maintaining a gap of up to 40 mil. This innovative design is crucial for improving the performance of electronic components.
Career Highlights
Yin-Chieh Hsueh is currently employed at Silicon Integrated Systems Corporation, where he continues to develop advanced packaging solutions. His expertise in semiconductor technology has positioned him as a key player in the industry.
Collaborations
Yin-Chieh has collaborated with notable colleagues, including Wei-Feng Lin and Chung-Ju Wu, who contribute to the innovative environment at Silicon Integrated Systems Corporation.
Conclusion
Yin-Chieh Hsueh's contributions to flip chip package structures exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to enhancing electronic device performance and reliability.