Jiji, Taiwan

Yi-Shing Liou


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: Yi-Shing Liou

Introduction

Yi-Shing Liou, an innovative inventor from Jiji, Taiwan, has made significant contributions to the field of communication technology. With one patent to his name, he has demonstrated his expertise in enhancing packet header compression, showcasing his skills as a forward-thinking inventor.

Latest Patents

Yi-Shing Liou's notable patent focuses on "Enhancement on Header Compression." The patent presents a method for packet header compression, which includes receiving a packet in a communication device equipped with resources for packet compression. The method involves parsing the header of the packet to extract header information and determining whether to compress the header based on this information and the status of the device's resources. This inventive approach contributes to more efficient data transmission and communication processes.

Career Highlights

Currently, Yi-Shing Liou works at MediaTek Corporation, a leading global semiconductor company. His role in the organization allows him to leverage his expertise in communication technologies, contributing to groundbreaking innovations in the industry.

Collaborations

Throughout his career, Yi-Shing has collaborated with talented coworkers, including Zhu-Jun Yang and Chih-Heng Shih. These collaborations enhance the innovative spirit within MediaTek Corporation, where teamwork drives the development of advanced communication solutions.

Conclusion

Yi-Shing Liou's contributions to packet header compression mark him as an influential inventor in the realm of communication technology. His innovative methods not only improve data transmission efficiency but also demonstrate the importance of collaboration in driving advancements in the technology sector. As a member of MediaTek Corporation, Liou continues to play a vital role in shaping the future of communication devices.

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