Yi Hsiu Liu

Title: Yi Hsiu Liu: Innovator in Die-Die Stacking Technology

Introduction

Yi Hsiu Liu is a prominent inventor based in Kaohsiung, CN. He has made significant contributions to the field of semiconductor technology, particularly in die-die stacking structures. With a total of two patents to his name, Liu's work focuses on enhancing the durability and performance of semiconductor devices.

Latest Patents

Liu's latest patent is titled "Die-die stacking structure and method for making the same." This invention relates to a die-die stacking structure that includes a top die with a bottom surface, a first insulation layer covering this surface, a bottom die with a top surface, and a second insulation layer covering the top surface of the bottom die. The structure features a plurality of connection members that communicate between the top die and the bottom die, along with a protection material positioned between the first and second insulation layers. This innovative design provides enhanced strength and stress buffering, effectively resisting die warpage and absorbing thermal cycling stress. As a result, it prevents cracking of bump and dielectric materials within the die-die stacking structure due to thermal or mechanical stress.

Career Highlights

Yi Hsiu Liu is currently employed at Advanced Micro Devices (Shanghai) Co., Ltd. His role at this leading technology company allows him to further develop his innovative ideas and contribute to advancements in semiconductor technology.

Collaborations

Liu collaborates with I-Tseng Lee, a fellow innovator in the field. Their partnership fosters a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Yi Hsiu Liu's contributions to die-die stacking technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the challenges faced in this field and offer practical solutions to enhance device performance and reliability.