Yi-Chieh Tsai

Title: Yi-Chieh Tsai: Innovator in Lead Frame Package Technology

Introduction

Yi-Chieh Tsai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

Yi-Chieh Tsai holds a patent for a lead frame package. This invention includes a first conductive layer, a first electronic component, lead frames, a second conductive layer, and a package body. The first conductive layer features conductive carriers, while the first electronic component is equipped with first pins. The lead frames and first pins are electrically connected to the conductive carriers. The second conductive layer contains conductive joints that connect to the lead frames, establishing an electrical connection to parts of the conductive carriers via the lead frames. The package body encapsulates the first conductive layer, the first electronic component, and the lead frames. Notably, the first and second conductive layers are positioned on opposite sides of the first electronic component.

Career Highlights

Yi-Chieh Tsai is affiliated with the Industrial Technology Research Institute, where he continues to develop innovative solutions in electronic packaging. His work has been instrumental in advancing the technology used in lead frame packages, contributing to the efficiency of electronic devices.

Collaborations

Some of his coworkers include Ren-Shin Cheng and Shih-Hsien Wu, who collaborate with him on various projects within the institute.

Conclusion

Yi-Chieh Tsai's contributions to lead frame package technology exemplify his commitment to innovation in the electronics field. His patent reflects a significant advancement in electronic component design, showcasing his expertise and dedication to improving technology.