Yi-An Sha

Title: Innovations by Yi-An Sha

Introduction

Yi-An Sha is a notable inventor based in Xindian, Taiwan. He has made significant contributions to the field of circuit protection devices, holding two patents that showcase his innovative approach to electrical safety.

Latest Patents

One of Yi-An Sha's latest patents is a circuit protection device. This device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, featuring a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer consists of an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is positioned between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is situated between the second lower electrically conductive layer and the second electrode layer. The external electrode is placed on the first electrode layer and extends beyond a peripheral wall in a horizontal direction.

Another significant patent by Yi-An Sha is an over-current protection device. This device comprises a resistor element, an outer electrode, and an encapsulation layer. The resistor element features a first insulation layer, a first electrically conductive layer, a PTC material layer, a second electrically conductive layer, and a second insulation layer stacked sequentially from bottom to top. The first insulation layer has a bottom surface and a first sidewall adjoining the bottom surface. The outer electrode includes a first electrode and a second electrode located on the bottom surface. These electrodes are electrically connected to the first conductive layer through the first and second vias, respectively. The encapsulation layer covers the first sidewall of the first insulation layer and extends to part of the bottom surface, forming a first perimeter on the bottom surface of the first insulation layer. The first and second electrodes are positioned inside this first perimeter.

Career Highlights

Yi-An Sha is currently employed at Polytronics Technology Corporation, where he continues to develop innovative solutions in the field of electrical engineering. His work focuses on enhancing the safety and efficiency of electronic devices through advanced circuit protection technologies.

Collaborations

Yi-An Sha collaborates with talented coworkers, including Yi-Hsuan Lee and Pin H