Yeonsung Kim

Title: Yeonsung Kim: Innovator in Integrated Device Packaging

Introduction

Yeonsung Kim is a prominent inventor based in Bedford, MA (US). He has made significant contributions to the field of integrated device packaging, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of electronic devices through innovative packaging solutions.

Latest Patents

Yeonsung Kim's latest patents include two notable inventions. The first is a "Low stress integrated device package," which discloses an integrated device package that features a housing defining a cavity. This package includes an integrated device die with a sensitive component on its first surface, while the second surface remains free from die attach material. The die cap is bonded to the first surface, and a supporting structure attaches the die cap to the package housing.

The second patent is for "Packaged devices with integrated antennas." This invention presents various embodiments of an integrated device package that incorporates antennas. In some cases, an antenna is defined along a die pad of the package, while in others, it is disposed in a first packaging component, with an integrated device die in a second component. These components can be stacked and electrically connected, allowing for multiple antennas to be positioned in different directions along the package body.

Career Highlights

Yeonsung Kim is currently employed at Analog Devices, Inc., where he continues to innovate in the field of integrated device packaging. His work has contributed to advancements in electronic device performance and reliability.

Collaborations

Throughout his career, Yeonsung Kim has collaborated with talented individuals such as Youn-Jae Kook and Dipak Sengupta. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Yeonsung Kim is a distinguished inventor whose work in integrated device packaging has led to significant advancements in the electronics industry. His innovative patents and collaborations highlight his commitment to enhancing device performance and functionality.