Company Filing History:
Years Active: 2014-2022
Title: Yeong Im Yu: Innovator in Semiconductor and Polymer Technologies
Introduction
Yeong Im Yu is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the fields of semiconductor technology and polymer chemistry. With a total of 2 patents, his work showcases innovative solutions that address industry challenges.
Latest Patents
One of Yeong Im Yu's latest patents is a dicing die-bonding film. This invention includes a substrate, an antistatic layer formed on the substrate with an aliphatic or alicyclic polyurethane resin and a conductive filler, a cohesive layer on the antistatic layer, and an adhesive layer on the cohesive layer. Additionally, it describes a dicing method of a semiconductor wafer using this dicing die-bonding film. Another notable patent is related to the manufacturing method of polyaspartic acid using maleic anhydride. This method involves condensation polymerization of maleic anhydride and ammonia in the presence of a polar solvent without active hydrogen, resulting in polysuccinimide, which is then hydrolyzed to obtain polyaspartic acid. The invention emphasizes improving the quality of the synthetic product by minimizing the decomposition and degradation of maleic acid during the polymerization process.
Career Highlights
Throughout his career, Yeong Im Yu has worked with notable companies such as LG Chem, Ltd. and Aekyung Petrochemical Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of materials science.
Collaborations
Yeong Im Yu has collaborated with talented individuals, including Ji Ho Han and Se Ra Kim. These partnerships have contributed to the advancement of his research and the successful development of his patents.
Conclusion
Yeong Im Yu's contributions to semiconductor and polymer technologies highlight his innovative spirit and dedication to advancing these fields. His patents reflect a commitment to improving product quality and efficiency in manufacturing processes.