Yehya M Kasem

Title: Yehya M Kasem: Innovator in Semiconductor Packaging

Introduction

Yehya M Kasem is a notable inventor based in Northboro, MA (US). He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of semiconductor devices.

Latest Patents

Yehya M Kasem holds 1 patent for his invention titled "Method for making a semiconductor package." This patent describes a process where a lead frame and die sub-assembly are manufactured using a conventional method. The process includes bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is then stacked adjacent to a dielectric plastic sheet, which is in turn stacked against a metal heat spreader block. The dielectric sheet features a centrally located hole that aligns with the die attach pad. An uncured resin is dispensed in the gap between the die attach pad and the block. This assembly is compressed between two hot platens, bonding the lead fingers, dielectric sheet, and block together while flattening the resin dollop to a controlled thickness. The thickness of the dielectric sheet ultimately controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the bonded portion of the lead frame is placed into a mold, and the stack assembly is encapsulated in a thermosetting resin to produce the semiconductor package.

Career Highlights

Yehya M Kasem is currently employed at Allegro Microsystems, LLC, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing semiconductor packaging technologies, making them more efficient and reliable.

Collaborations

Yehya has collaborated with notable colleagues such as Bela G Nagy and Leonard G Feinstein. Their combined expertise has contributed to the success of various projects within the semiconductor field.

Conclusion

Yehya M Kasem's contributions to semiconductor packaging through his innovative methods have made a significant impact on the industry. His work exemplifies the importance of innovation in technology and its role in advancing modern electronics.