New York, NY, United States of America

Yeh-Hsing Lao

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yeh-Hsing Lao: Innovator in DNA-Templated Micelle Technology

Introduction

Yeh-Hsing Lao is a prominent inventor based in New York, NY (US). He has made significant contributions to the field of biotechnology, particularly in the development of multifunctional systems for drug delivery.

Latest Patents

Yeh-Hsing Lao holds a patent for a "DNA-templated micelle and uses thereof." This invention discloses a multifunctional DNA-templated micelle system that includes a payload carrier of at least a DNA bridge and a functionalized polyethylene glycol (PEG) segment. The micelle is designed to deliver molecules, such as drugs and polynucleotides, to targeted cells for pharmaceutical applications. The PEG segment provides a functional group, such as amine, for ligand conjugation. This innovative micelle is highly controllable in size, loading efficiency, and tissue targeting. It can carry multiple payloads for targeted combination strategies in cancer therapy, including gene delivery, gene therapy, and immunotherapy.

Career Highlights

Yeh-Hsing Lao is affiliated with Columbia University, where he continues to advance research in the field of biotechnology. His work has garnered attention for its potential applications in improving cancer treatment methodologies.

Collaborations

Some of his notable coworkers include Kam W Leong and Tzu-Chieh Ho, who have collaborated with him on various research projects.

Conclusion

Yeh-Hsing Lao's innovative work in DNA-templated micelle technology represents a significant advancement in drug delivery systems. His contributions have the potential to enhance therapeutic strategies in cancer treatment and beyond.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…