Yee Ming Chan

Title: Innovations by Yee Ming Chan

Introduction

Yee Ming Chan is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. With a focus on enhancing device reliability, Chan has made significant strides in the field of intermetal dielectric adhesion.

Latest Patents

Chan holds a patent for an invention titled "Enhanced intermetal dielectric adhesion." This patent describes a device and method for forming a semiconductor device that includes a back-end-of-line dielectric (BEOL) with multiple intermetal dielectric (IMD) levels over a substrate. The BEOL features an upper IMD level and upper metal lines, with a buffer layer positioned over the upper metal lines. This buffer layer is crucial as it improves the adhesion of the upper IMD layer, which in turn enhances the reliability of the semiconductor device.

Career Highlights

Yee Ming Chan is currently employed at Systems on Silicon Manufacturing Company Pte. Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Chan collaborates with talented professionals in his field, including Pankaj Kumar Uttwani and Shankaran Chelliah. These partnerships contribute to the development of cutting-edge technologies and solutions in semiconductor manufacturing.

Conclusion

Yee Ming Chan's innovative work in enhancing intermetal dielectric adhesion showcases his commitment to improving semiconductor device reliability. His contributions are vital to the ongoing advancements in the technology sector.