Lagrangeville, NY, United States of America

Yea-Sen Lin


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1992-2010

Loading Chart...
3 patents (USPTO):

Title: Yea-Sen Lin: Innovator in Optical Rule Checking and Substrate Machining

Introduction

Yea-Sen Lin is a notable inventor based in Lagrangeville, NY (US). He has made significant contributions to the fields of optical rule checking and substrate machining. With a total of 3 patents, Lin's work has advanced the technology used in semiconductor manufacturing.

Latest Patents

One of Lin's latest patents is titled "System and method for implementing optical rule checking to identify and quantify corner rounding errors." This method involves receiving corner rounding data based on established ground rules and determining a simulated shape for a semiconductor device feature produced on a wafer. The process includes selecting a corner feature associated with the designed shape and drawing triangles at the selected corner feature to assess corner rounding.

Another significant patent is the "Substrate machining verifier." This system utilizes an energy beam to impinge upon machined features of substrates, along with a photodiode switching circuit matrix for detecting the energy beam's interaction with the machined features. The system enhances the accuracy of the machining process by comparing digital outputs with predetermined data.

Career Highlights

Yea-Sen Lin is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in his field. His work has been instrumental in improving the efficiency and accuracy of semiconductor manufacturing processes.

Collaborations

Lin has collaborated with several talented individuals, including Anthony F Coneski and Ramon E De La Cruz. These collaborations have contributed to the development of advanced technologies in his area of expertise.

Conclusion

Yea-Sen Lin's contributions to optical rule checking and substrate machining demonstrate his commitment to innovation in technology. His patents reflect a deep understanding of semiconductor manufacturing processes and a drive to enhance their efficiency.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…