Sulta-City, Osaka 564-0044, Japan

Yasutomo Okajima


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:

goldMedal1 out of 832,718 
Other
 patents

Years Active: 2008

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yasutomo Okajima: Innovator in Substrate-Cutting Technology

Introduction

Yasutomo Okajima is a notable inventor based in Sulta-City, Osaka, Japan. He has made significant contributions to the field of substrate-cutting technology. His innovative approach has led to the development of a unique substrate-cutting system that enhances efficiency in manufacturing processes.

Latest Patents

Yasutomo Okajima holds 1 patent for his invention titled "Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method." This patent describes a clamping device installed on a stand with a hollow rectangular parallelepiped shape. The device is designed to clamp at least one side edge portion of a mother board during transport. The invention features a pair of substrate-cutting devices that cut the mother substrate from both its upper and lower faces. These devices are mounted on a scribing device guide body that is movable along one side of the stand. The design allows for precise cutting and scribing, improving the overall manufacturing process.

Career Highlights

Throughout his career, Yasutomo Okajima has focused on advancing substrate technology. His work has been instrumental in developing systems that streamline production and enhance product quality. His innovative designs have garnered attention in the industry, showcasing his expertise and commitment to technological advancement.

Collaborations

Yasutomo Okajima has collaborated with notable colleagues, including Yoshitaka Nishio and Yukio Oshima. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Yasutomo Okajima's contributions to substrate-cutting technology exemplify his innovative spirit and dedication to improving manufacturing processes. His patent reflects a significant advancement in the field, and his collaborations further enhance the impact of his work.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…