Company Filing History:
Years Active: 1994-1996
Title: Yasuhisa Nagano: Innovator in Mechanical Plating Technology
Introduction
Yasuhisa Nagano is a prominent inventor based in Okayama, Japan. He has made significant contributions to the field of mechanical plating, particularly through his innovative methods of creating ejection powders. With a total of 2 patents to his name, Nagano's work has advanced the technology used in various industrial applications.
Latest Patents
Nagano's latest patents include a method of making ejection powder for mechanical plating and a mechanical plating method for forming a zinc alloy film by ejecting heat. The first patent describes an ejection material in powder form, where each particle consists of an iron alloy core covered with a zinc alloy layer. This process involves thermal treatment at temperatures between 300°C and 700°C, ensuring that the zinc alloy layer achieves a Vicker's hardness ranging from 60 to 370. The second patent outlines a mechanical plating method that involves ejecting powder onto a surface to form a zinc alloy film. This ejection powder is created by mixing iron or iron alloy nuclei with a zinc alloy melt, cooling it to form a solidified alloy, and then crushing it. The powder undergoes heat treatment to adjust the Vicker's hardness of the zinc alloy to between 60 and 370.
Career Highlights
Yasuhisa Nagano is currently associated with Dowa Iron Powder Co., Ltd., where he continues to develop and refine his innovative techniques. His work has been instrumental in enhancing the efficiency and effectiveness of mechanical plating processes.
Collaborations
Nagano has collaborated with notable colleagues, including Masatsugu Watanabe and Hajime Shimoyama, contributing to the advancement of their shared field of expertise.
Conclusion
Yasuhisa Nagano's contributions to mechanical plating technology through his innovative patents have positioned him as a key figure in the industry. His work continues to influence the development of advanced materials and processes.