Yanqin Liao

Title: Yanqin Liao: Innovator in Chip Package Technology

Introduction

Yanqin Liao is a prominent inventor based in Xi'an, China. She has made significant contributions to the field of chip packaging technology. Her innovative work has led to the development of a unique chip package structure that enhances the efficiency and reliability of electronic devices.

Latest Patents

Yanqin Liao holds 1 patent for her invention titled "Chip package structure having a package substrate disposed around a die." This patent describes a chip package structure that includes a die and a package substrate surrounding the die. A solder joint is placed on the first surface of the die, while the remaining surfaces are wrapped in an injection molding material. Notably, at least one pair of opposite sides of the package substrate is embedded in the injection molding material, ensuring a robust connection.

Career Highlights

Yanqin Liao is currently employed at Huawei Technologies Co., Limited, where she continues to push the boundaries of innovation in chip packaging. Her work is instrumental in advancing the technology used in modern electronic devices.

Collaborations

She collaborates with talented colleagues, including Jianping Fang and Haohui Long, who contribute to her innovative projects and research.

Conclusion

Yanqin Liao's contributions to chip packaging technology exemplify her dedication to innovation and excellence in her field. Her patent and ongoing work at Huawei Technologies Co., Limited highlight her role as a leading inventor in the industry.