Company Filing History:
Years Active: 2023
Title: Yang Wang: Innovator in Heat Transfer Technology
Introduction
Yang Wang is a prominent inventor based in Hong Kong, China. He has made significant contributions to the field of heat transfer technology. His innovative approach has led to the development of a unique heat transferring device that enhances thermal efficiency.
Latest Patents
Yang Wang holds a patent for a "Heat transferring device and method for making thereof." This invention provides a heat transferring device that features a thermal conducting substrate with a plurality of protrusions and concave bottom surfaces. The porous layer is embedded between the protrusions, allowing for improved heat transfer. Additionally, the invention includes a high-temperature material transferring system that comprises a cylindrical container with the heat transferring device affixed to its surface. This patent showcases his expertise in thermal management solutions.
Career Highlights
Yang Wang is affiliated with the City University of Hong Kong, where he continues to advance research in heat transfer technologies. His work has garnered attention for its practical applications in various industries, including electronics and energy systems. With a focus on innovation, he strives to develop solutions that address contemporary challenges in thermal management.
Collaborations
Yang Wang collaborates with esteemed colleagues such as Zuankai Wang and Mengnan Jiang. Their combined expertise fosters a dynamic research environment that encourages the exploration of new ideas and technologies.
Conclusion
Yang Wang's contributions to heat transfer technology exemplify the impact of innovative thinking in engineering. His patent and ongoing research at the City University of Hong Kong highlight his commitment to advancing the field. Through collaboration and dedication, he continues to push the boundaries of what is possible in thermal management solutions.