Milpitas, CA, United States of America

Yafu J Ding


Average Co-Inventor Count = 2.0

ph-index = 8

Forward Citations = 364(Granted Patents)


Company Filing History:


Years Active: 2000-2007

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9 patents (USPTO):Explore Patents

Title: Yafu J Ding: Pioneering Innovations in Multi-Path Failover Systems

Introduction:

Yafu J Ding, a distinguished innovator hailing from Milpitas, CA, has left an indelible mark on the world of technology, electronics, and telecommunications. With a career spanning numerous industries and an impressive collection of patents, Ding has demonstrated his expertise in revolutionizing existing technologies. In this article, we delve into his latest patents, career highlights, and collaborations, highlighting his significant contributions to the field of innovation.

Latest Patents:

One of Ding's recent patents, titled "Methods and apparatus for a segregated interface for parameter configuration in a multi-path failover system," unveils an inventive solution for configuring parameters in such systems. This segregated user interface encompasses a user interface module that receives configuration parameters, and an object module that handles the received parameters, detects controller and device statuses, and configures a failover driver. This patent showcases Ding's dedication to enhancing the functionality and reliability of multi-path failover systems.

Career Highlights:

Throughout his career, Ding has achieved several noteworthy milestones. Working with renowned companies like Adaptec, Inc. (now Microsemi Corporation), Ding has continuously pushed the boundaries of innovation. His expertise and groundbreaking inventions have propelled the field of multi-path failover systems forward, providing improved reliability and optimal performance.

Collaborations:

Ding has had the privilege of collaborating with talented individuals in his field. Notably, he has worked alongside Eric Cheng and Chang-Tying Wu, who contributed to the development and implementation of his inventions. Through collaborations like these, Ding has been able to leverage diverse perspectives and expertise, leading to even more impactful innovations.

Conclusion:

Yafu J Ding's innovative contributions have undoubtedly earned him a well-deserved place among the industry's brightest minds. With his trailblazing patents in the realm of multi-path failover systems and successful collaborations, Ding has left an enduring legacy in the world of technology, electronics, and telecommunications. As we look to the future, it is clear that his innovative spirit and commitment to pushing boundaries will continue to shape the landscape of innovation.

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