ShangHai, China

Xufeng Hao


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Xufeng Hao - Innovator in Nano-Carbon Composite Technology

Introduction

Xufeng Hao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of materials science, particularly in the development of advanced composite materials. His innovative work focuses on creating high-performance materials that meet the demands of modern technology.

Latest Patents

Xufeng Hao holds a patent for a "Light-weight flexible high-thermal-conductivity nano-carbon composite film and method for preparing same." This invention provides a solution for creating a nano-carbon composite film that is not only lightweight and flexible but also exhibits high thermal conductivity. The film consists of multiple composite units that are laminated together, featuring flexible adhesive layers and a graphene film layer. The preparation method involves sequential lamination and hot pressing, resulting in a film with impressive thermal conductivity of up to 500 W/m·K or higher, while maintaining a density of 2.0 g/cm³ or less. Remarkably, the film retains its thermal conductivity even after being bent 180° for 50 cycles without any peeling of the graphene layer.

Career Highlights

Xufeng Hao is associated with Shanghai Composites Science & Technology Co., Ltd., where he continues to push the boundaries of composite material technology. His work has garnered attention for its potential applications in various industries, including electronics and aerospace.

Collaborations

Xufeng Hao collaborates with talented colleagues such as Qianli Liu and Feng Shen, contributing to a dynamic research environment that fosters innovation and creativity.

Conclusion

Xufeng Hao's contributions to the field of nano-carbon composites exemplify the spirit of innovation. His patented technology not only enhances material performance but also opens new avenues for future applications.

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