Xuequan Yu

Title: Xuequan Yu: Innovator in Electronic Component Packaging

Introduction

Xuequan Yu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of electronic component packaging, holding three patents to his name. His work focuses on improving the efficiency and effectiveness of electronic devices through innovative packaging solutions.

Latest Patents

Xuequan Yu's latest patents include an electronic component package structure and an electronic device. The first patent describes an electronic component package structure that features a substrate with an attachment area for electronic components. It includes a conductive lid with a sidewall that extends toward the substrate. The bonding end of the sidewall is secured to the substrate using a non-conductive adhesive, creating a shielding space over the attachment area. This design aims to enhance the Electromagnetic Interference (EMI) shielding effect. The second patent reiterates similar features, emphasizing the dielectric constant of the adhesive and its thickness, which are crucial for optimal performance.

Career Highlights

Xuequan Yu is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His role at Huawei allows him to leverage his expertise in electronic component packaging to contribute to cutting-edge technology solutions.

Collaborations

Xuequan Yu has collaborated with notable colleagues, including Yadong Bai and Lin Yang. Their combined efforts in research and development have further advanced the field of electronic component packaging.

Conclusion

Xuequan Yu's innovative work in electronic component packaging has positioned him as a key figure in the industry. His patents reflect a commitment to enhancing electronic device performance through effective shielding solutions. His contributions continue to influence the future of technology in significant ways.