Company Filing History:
Years Active: 2017
Title: Innovations by Xiayan Wang in Microchip Technology
Introduction
Xiayan Wang is a notable inventor based in Beijing, China. He has made significant contributions to the field of microchip technology, particularly through his innovative patent. His work focuses on enhancing the precision and efficiency of microstructure alignment and bonding processes.
Latest Patents
Xiayan Wang holds a patent titled "Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chip." This method belongs to the micromachining and bonding technologies of microchips. The process involves several steps, including the removal of photoresist and chromium layers from glass or quartz microchips, followed by thorough cleaning with nonionic surfactants and ultra-pure water. The surface is then treated to enhance hydrophilicity using a plasma cleaning device. Precise alignment is achieved through the movement of the substrate and cover plate, observed under a microscope. A small amount of ultrapure water is introduced for adhesion, and vacuum drying is employed to ensure complete removal of water. This method allows for permanent bonding through a subsequent thermal bonding process, completing the operation within 30 minutes. The advantages of this method include speed, efficiency, ease of use, operational safety, and broad applications.
Career Highlights
Xiayan Wang is affiliated with the Beijing University of Technology, where he continues to advance his research and innovations in microchip technology. His work has garnered attention for its practical applications and potential impact on the industry.
Collaborations
Xiayan Wang collaborates with esteemed colleagues, including Guangsheng Guo and Siyu Wang, who contribute to his research endeavors and innovations.
Conclusion
Xiayan Wang's contributions to microchip technology through his innovative patent demonstrate his commitment to advancing the field. His methods promise to enhance the efficiency and effectiveness of microstructure alignment and bonding processes.