Location History:
- San Diego, CA (US) (2002)
- Vista, CA (US) (2000 - 2004)
Company Filing History:
2 out of 5 
1 out of 1 
1 out of 2 Years Active: 2000-2004
Title: Innovations of Xiaoqi Zhu in Semiconductor Technology
Introduction
Xiaoqi Zhu is a notable inventor based in Vista, CA (US), recognized for his contributions to semiconductor technology. With a total of 7 patents, Zhu has made significant advancements in the field, particularly in the area of flip-chip packaging.
Latest Patents
One of Zhu's latest patents is titled "Semiconductor flip-chip package and method for the fabrication thereof." This innovation presents a simplified process for flip-chip attachment of a chip to a substrate. The method involves precoating the chip with an encapsulant underfill material that contains separate discrete solder columns. This approach eliminates the conventional capillary flow underfill process, allowing for the incorporation of remeltable layers for rework, testing, or repair. Additionally, it facilitates the integration of electrical redistribution layers. The process includes placing the chip and pre-coated encapsulant at an angle to the substrate, pivoting them to expel gas until the solder bumps are fully in contact with the substrate. Furthermore, the design features a compliant solder/flexible encapsulant understructure that adapts to the substrate's expansion or contraction, effectively absorbing strain caused by differing thermal coefficients of expansion.
Career Highlights
Throughout his career, Xiaoqi Zhu has worked on various innovative projects that have advanced semiconductor technology. His expertise in flip-chip packaging has positioned him as a key figure in the industry.
Collaborations
Zhu has collaborated with notable professionals, including Miguel Albert Capote and Zhiming Zhou, contributing to the development of cutting-edge technologies in semiconductor applications.
Conclusion
Xiaoqi Zhu's work in semiconductor technology, particularly his innovative approaches to flip-chip packaging, showcases his significant impact on the field. His patents reflect a commitment to advancing technology and improving manufacturing processes.