Qianwu, China

Xianming Chen Simon Chan


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Xianming Chen Simon Chan and His Contributions to Electronic Packaging

Introduction: Xianming Chen Simon Chan, an accomplished inventor based in Qianwu, China, has made significant strides in the field of electronic packaging with his innovative designs. With a single patent to his name, Chan has demonstrated his prowess in creating efficient and advanced electronic chip packages.

Latest Patents: Chan's standout patent is for a "Single Layer Coreless Substrate," a novel electronic chip package that features at least one chip bonded to a routing layer of an interposer. This interposer comprises a routing layer and a via post layer, all enveloped in a dielectric material that incorporates glass fibers within a polymer matrix. This inventive package is further enhanced by a second layer of dielectric material that encapsulates the chip, routing layer, and wires, along with methods for fabricating such advanced electronic chip packages.

Career Highlights: Chan is currently employed at Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., where he continues to drive innovation in electronic substrate technologies. His work primarily focuses on enhancing the performance and reliability of electronic packaging solutions that are essential in modern electronics.

Collaborations: Throughout his career, Chan has collaborated with notable professionals such as Dror Hurwitz and Shih-Fu Alex Huang. These partnerships highlight his dedication to teamwork and collective innovation, further pushing the boundaries of what is possible in electronic design.

Conclusion: Xianming Chen Simon Chan’s contributions to electronic packaging through his patent for the Single Layer Coreless Substrate demonstrates the crucial role inventors play in shaping technological advancements. His ongoing work at Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. and collaborations with fellow inventors position him as an influential figure in the realm of electronics.

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