Company Filing History:
Years Active: 2019-2021
Title: **Innovative Contributions of Xiangfei Yu in Electronic Component Cooling Technologies**
Introduction
Xiangfei Yu is a notable inventor based in Troy, NY, specializing in advanced cooling methods for electronic components. With a total of two patents to his name, Yu has made significant strides in the field of thermal management, addressing the ever-growing demands of electronic efficiency and reliability.
Latest Patents
Xiangfei Yu's latest patents focus on "Methods, systems, and assemblies for cooling an electronic component." These patents disclose an innovative heat sink assembly comprising first and second substrates. The first substrate is designed to be in thermal contact with the electronic component, while the primary channel formed in its second surface directs cooling fluid effectively. An array of primary cooling fluid fins, including both solid and open fins, enhances the cooling process by directing the flow of cooling fluid strategically. Additionally, a secondary channel formed in the second substrate is designed to carry partially heated cooling fluid away from the component, thus ensuring optimal thermal regulation.
Career Highlights
Xiangfei Yu is affiliated with the Rensselaer Polytechnic Institute, a well-regarded research institution that fosters innovation and technology development. His work focuses on the intersection of thermal management and electronic component performance, contributing solutions that reflect his deep understanding of these critical engineering challenges.
Collaborations
Yu collaborates closely with esteemed colleagues, including Corey Christopher Woodcock and Joel L Plawsky. These partnerships within the research community support a multidisciplinary approach to solving complex problems related to electronic component cooling, enhancing the overall impact of their work in the field.
Conclusion
With his innovative patents and collaborative efforts, Xiangfei Yu continues to be a significant contributor to the field of electronic component cooling technologies. His expertise and commitment to research not only advance the understanding of thermal management but also pave the way for future innovations that improve the efficiency of electronic devices.