Company Filing History:
Years Active: 2015-2017
Title: Wu Wenli - Innovator in Bundle Spacing Technology
Introduction
Wu Wenli is a notable inventor based in Wuxi, China. He has made significant contributions to the field of engineering, particularly with his innovative designs in bundle spacing devices. With a total of 2 patents to his name, Wu has demonstrated a commitment to advancing technology in his area of expertise.
Latest Patents
Wu Wenli's latest patents focus on a bundle spacing device. This device features a first pair of opposing surfaces spaced apart from each other at a first distance, and a second pair of opposing surfaces spaced apart at a different second distance. These surfaces are generally perpendicular to each other. The design allows for bundles to be coupled to the device in either a first or second position. Additionally, the device includes multiple passages extending along different axes, enhancing its functionality and versatility.
Career Highlights
Wu is currently employed at Panduit Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in improving the efficiency and effectiveness of bundle spacing solutions.
Collaborations
Some of Wu's coworkers include Jonathan A DeMik and Michael J Vermeer. Their collaboration fosters a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Wu Wenli's contributions to the field of bundle spacing technology highlight his innovative spirit and dedication to engineering. His patents reflect a deep understanding of the complexities involved in creating effective solutions.