Woody Ray Smith

Title: Woody Ray Smith: Innovator in Polishing and Component Transport Technologies

Introduction

Woody Ray Smith is a notable inventor based in Essex Junction, VT (US). He has made significant contributions to the fields of polishing technology and component transport systems. With a total of 2 patents, Smith's work reflects a commitment to innovation and practical solutions in engineering.

Latest Patents

Smith's latest patents include the "Stacked Polish Pad" and the "Component Carrier Having a Wave Pattern Tension Reduction Surface." The Stacked Polish Pad patent describes a polishing pad assembly designed for use in a chemical-mechanical polishing apparatus. This assembly features a first pad with a sealable enclosure that can adjust its hardness based on the fluid levels within. The second patent focuses on a container system for storing and transporting sensitive components, such as semiconductor chips. This system utilizes a housing and multiple component carriers arranged in a stacked configuration, designed to minimize damage to the components during transport.

Career Highlights

Woody Ray Smith is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative solutions in technology. His work has been instrumental in advancing the efficiency and effectiveness of polishing and component transport systems.

Collaborations

Throughout his career, Smith has collaborated with notable colleagues, including Shyng-Tsong Chen and Michael F. Lofaro. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Woody Ray Smith's contributions to innovation in polishing and component transport technologies highlight his expertise and dedication to engineering. His patents serve as a testament to his inventive spirit and the impact of his work in the industry.