Woo-Beom Choi

Title: Innovations of Woo-Beom Choi in Electrostatic Thermal Bonding

Introduction

Woo-Beom Choi is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of materials science, particularly in the area of glass substrate bonding. His innovative approach addresses common challenges faced in conventional bonding methods.

Latest Patents

Woo-Beom Choi holds a patent for a method titled "Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film." This method provides a solution to issues such as device contamination and incomplete vacuum packaging, which are prevalent when using traditional epoxy or frit bonding techniques. The process involves depositing a silicon thin film on a metal thin film on one glass substrate. The two glass substrates are then brought into contact, and a direct current voltage is applied under specific temperature conditions. This innovative bonding technique enhances bonding strength and improves vacuum packaging.

Career Highlights

Choi is affiliated with the Korea Institute of Science and Technology, where he continues to advance research in materials and bonding technologies. His work has garnered attention for its practical applications in various industries.

Collaborations

Some of his notable coworkers include Byeong-kwon Ju and Myung-Hwan Oh, who have collaborated with him on various projects related to his research.

Conclusion

Woo-Beom Choi's contributions to electrostatic thermal bonding represent a significant advancement in the field of materials science. His innovative methods not only improve bonding strength but also address critical issues in device packaging.