Company Filing History:
Years Active: 2024
Title: Innovations by Wonjung Jang in Semiconductor Packaging
Introduction
Wonjung Jang is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and patents.
Latest Patents
Wonjung Jang holds a patent for a package substrate and semiconductor package that includes a unique design. The package substrate features an insulating layer with a mounting surface, a wiring pattern extending within the insulating layer, and a chip bonding pad on the mounting surface. This chip bonding pad is characterized by a tapered shape, where the horizontal cross-sectional area gradually decreases as it moves away from the mounting surface. Specifically, the portion of the chip bonding pad closest to the mounting surface has a horizontal length ranging from about 20 micrometers (μm) to about 30 μm.
Career Highlights
Wonjung Jang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work focuses on advancing semiconductor technologies, contributing to the development of more efficient and effective packaging solutions.
Collaborations
Wonjung Jang collaborates with his coworker, Chulyong Jang, to further enhance their research and development efforts in semiconductor packaging.
Conclusion
Wonjung Jang's innovative work in semiconductor packaging exemplifies the importance of creativity and technical expertise in advancing technology. His contributions are vital to the ongoing evolution of the electronics industry.