Modesto, CA, United States of America

Wolfgang W Hoffmann


Average Co-Inventor Count = 1.3

ph-index = 3

Forward Citations = 113(Granted Patents)


Company Filing History:


Years Active: 1986-1990

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations by Wolfgang W. Hoffmann

Introduction

Wolfgang W. Hoffmann is a notable inventor based in Modesto, California, recognized for his contributions to packaging technology. With a total of four patents to his name, Hoffmann has developed innovative methods that enhance the efficiency and effectiveness of container labeling and thermoplastic applications.

Latest Patents

Hoffmann's latest patents include a method of applying a thermoplastic strip to a container. This method involves using a cylindrical mandrel with vacuum openings to wrap a thermoplastic strip around a container. The strip is heat shrunk to conform closely to the container's contour, ensuring a snug fit. Another significant patent is the method of adhering labels to containers. This process involves severing a plastic label from a polymer strip, applying hot melt adhesive to the leading edge, and a solvent to the trailing edge. When heat is applied, the tacky solution solidifies, allowing for a secure attachment of the label to the container.

Career Highlights

Throughout his career, Hoffmann has worked with several companies, including Shibuya America Corporation and Kris-Tech Corporation. His experience in these organizations has contributed to his expertise in packaging technologies and innovation.

Collaborations

Hoffmann has collaborated with various professionals in his field, including Svatoboj Otruba, enhancing his work through shared knowledge and expertise.

Conclusion

Wolfgang W. Hoffmann's innovative patents and career achievements reflect his significant impact on the packaging industry. His methods for applying thermoplastic materials and adhering labels to containers demonstrate his commitment to advancing technology in this field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…