Heidelberg, Germany

Wolfgang Lepka


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1994-2003

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2 patents (USPTO):Explore Patents

Title: Wolfgang Lepka: Innovator in Polymer Technology

Introduction

Wolfgang Lepka is a notable inventor based in Heidelberg, Germany. He has made significant contributions to the field of polymer technology, particularly in the development of elastifying and extending methods for various polymers. His innovative approaches have led to the creation of useful materials in sealing and adhesive applications.

Latest Patents

Wolfgang Lepka holds two patents that showcase his expertise. The first patent is titled "Method for elastifying and extending polymers with PVC-homo-and copolymers or with EVA-copolymers in gel form." This patent describes methods for enhancing the properties of polymers, making them suitable for use as sealing materials, adhesives, and sealants. The second patent is for a "Molding and sealing compound," which is a one-component formulation based on prepolymers with terminal silyl groups. This compound includes organo-metallic tin compounds as catalysts and inorganic fillers, providing a thixotropic effect to reduce surface tackiness.

Career Highlights

Throughout his career, Wolfgang Lepka has worked with prominent companies in the industry. He has been associated with Teroson GmbH and Henkel Kommanditgesellschaft Auf Aktien, where he has applied his innovative ideas to develop advanced polymer solutions.

Collaborations

Wolfgang has collaborated with notable colleagues, including Gabriele Bride and Gisbert Kern. These partnerships have contributed to the advancement of his research and the successful implementation of his inventions.

Conclusion

Wolfgang Lepka's contributions to polymer technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the development of materials used in various applications.

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