Company Filing History:
Years Active: 2010
Title: Wolfgang Bollinger: Innovator in Heat Sink Technology
Introduction
Wolfgang Bollinger is a notable inventor based in Herrenberg, Germany. He has made significant contributions to the field of electronics through his innovative patent related to heat sink installations. His work is particularly relevant in the context of circuit board manufacturing and testing.
Latest Patents
Wolfgang Bollinger holds a patent for a "Method of providing flexible heat sink installations for early blade board manufacturing." This invention describes an apparatus designed to mount multiple heat sinks onto a circuit board during testing. The apparatus features a polygonal-shaped frame that is specifically sized to fit an area on the circuit board containing several data processing elements that require cooling. The design includes at least four apertures corresponding to different data processing elements, ensuring efficient heat dissipation. Notably, the apparatus does not require additional screws, adhesives, or clips for securing the heat sinks, simplifying the manufacturing process.
Career Highlights
Bollinger is associated with the International Business Machines Corporation (IBM), where he has applied his expertise in electronics and manufacturing. His innovative approach has contributed to advancements in the efficiency and effectiveness of circuit board testing and cooling solutions.
Collaborations
Wolfgang has collaborated with notable colleagues such as Gerald Kreissig and Roland Dieterle. Their combined efforts have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Wolfgang Bollinger's contributions to heat sink technology exemplify the importance of innovation in the electronics industry. His patent not only enhances the manufacturing process but also sets a precedent for future developments in circuit board technology.