Hechtel, Belgium

Wim Deferme

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 2.8

ph-index = 1


Location History:

  • Hechtel, BE (2022 - 2023)
  • Hechtelt, BE (2023)

Company Filing History:


Years Active: 2022-2023

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3 patents (USPTO):Explore Patents

Title: Wim Deferme: Innovator in Electronic Assembly and Thin Film Technology

Introduction

Wim Deferme is a notable inventor based in Hechtel, Belgium. He has made significant contributions to the fields of electronic assembly and thin film technology. With a total of three patents to his name, Deferme's work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

One of his latest patents is focused on an interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device. This invention includes conductive lines arranged in a plane, connectors that define an overlap between conductive lines and stretchable conductive lines, and an anchoring structure that provides stability. Another patent involves a method and apparatus for applying thin film material onto a substrate. This method includes forming microdroplets of a solvent and solute, depositing them on a micro-structured mesh, and utilizing capillary forces to draw liquid onto the substrate, resulting in a liquid film formation.

Career Highlights

Wim Deferme has worked with prominent organizations such as Imec Vzw and Universiteit Hasselt. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

Throughout his career, Deferme has collaborated with talented individuals, including Rachith Shanivarasanthe Nithyananda Kumar and Steven Nagels. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Wim Deferme's contributions to electronic assembly and thin film technology highlight his role as a significant inventor in the field. His innovative patents and collaborations reflect his commitment to advancing technology and solving engineering challenges.

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